Published: April 3, 2000

The Boulder Faculty Assembly and the Office of the Vice Chancellor for Student Affairs are sponsoring a public forum on a proposed code of conduct for CU-licensed apparel manufacturers on April 6.

Sessions will be held from 12:15 p.m. to 1:15 p.m. in the Dalton Trumbo Fountain Court of the University Memorial Center and from 3 p.m. to 5 p.m. in the UMC Grill.

Last month the BFA executive committee approved a resolution from its student affairs committee to endorse a set of human rights principles with which CU licensees should comply.

According to Ira Chernus, chair of the BFA student affairs committee, the purpose of the meetings is to generate campus-wide discussion on the universityÂ’s policies for companies that are granted the right to manufacture clothing and other products bearing the universityÂ’s name, logos or other trademarks.

"This forum is a way for faculty to take the lead in responding to Chancellor Byyny's call for a campus-wide discussion of the issue," said Chernus. "I am pleased that the Chancellor is promoting discussion on such a vital ethical issue and I am pleased that so many sectors of the campus community are responding to his call."

Speakers representing a variety of viewpoints are expected to participate, including Ron Stump, vice chancellor for student affairs, Boulder Mayor Will Toor, who is director of CU-BoulderÂ’s Environmental Center, representatives of BFA, UCSU, and the student coalition WAAKE-UP. Faculty members doing research on global labor issues also will be represented, including Kayann Short of Women's Studies and David Pellow of Ethnic Studies.

An additional public forum is tentatively scheduled for April 25 from 3 p.m. to 5 p.m. in the UMC Grill.

Discussion of labor standards for CU trademark licensees also will continue April 7-8 at a conference sponsored by CU-BoulderÂ’s Center for Asian Studies, "Asian Human Rights: Critical Issues." A panel discussion on "Labor and Workplace Rights in Asia" will be held on Saturday, April 8.

For more information, visit the conference Web site at .